Machinery & Equipment
Description
Homray Material Technology can provide various diamond back side grinding wheels for grinding machine with many brands. They are mainly used for the thinning and fine grinding of the silicon wafer. These products produced by in-house facility, which ensures excellent grinding performance and lower cost for our customers in the world.
back side diamond grinding wheel manufacturer, LED substrate back side grinding wheel,Read More
Homray Material Technology
Double side lapping carrier, Blue steel lapping carrier, Diamond Cutting Wire, Ceramic Block, Ceramic conditional ring, Pure copper polishing plate,
Address: LiSheng Industrial Building,60 Suli Road,
Suzhou, Jiangsu
China, 215000
Tel: 0086-67084276
Fax: