Homray Material Technology
Introduction
Homray as the leading manufacturer and supplier of good quality diamond cutting wire, double side lapping carrier, epoxy resin working carrier, blue steel lapping carrier and ceramic block for wafer bonding, resin copper polishing plate, ductile cast iron lapping plate ,diamond edge grinding wheel, back side grinding wheel and ceramic conditioning ring etc. Our diamond cutting wire, resin lapping carrier and other consumables are widely used in various Multi Wire Saw Machine, Double Side Lapping Machine, DMP Machine (Cu Polishing Machine) for LED sapphire substrate wafer polishing, lapping process and LED EPI wafer thinning process.
Lastest Products
Homray Material Technology
Double side lapping carrier, Blue steel lapping carrier, Diamond Cutting Wire, Ceramic Block, Ceramic conditional ring, Pure copper polishing plate,
Address: LiSheng Industrial Building,60 Suli Road,
Suzhou, Jiangsu
China, 215000
Tel: 0086-67084276
Fax:
