araBead Gold Particles GD 0575
GD 0575
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China FaraBead Gold Particles GD 0575 with High-Quality, Leading FaraBead Gold Particles GD 0575 Manufacturers & Suppliers, find FaraBead Gold Particles GD 0575 Factory & Exporters.
Nanomicro Tech provides high quality FaraBead® gold-plated particles for microelectronic packaging in electronics manufacturing. With increasing resolutions and decreasing number of circuit chips or modules in liquid-crystal displays (LCD), the input/output (I/O) density in integrated circuit increases while the size and pitch of the interconnection bumps are becoming very small. FaraBead® Au particles are electrically conductive and typically dispersed in a binder to form anisotropic conductive adhesive (ACA) materials such as anisotropic conductive film (ACF) or anisotropic conductive paste (ACP) employed in the connection of microelectrodes. FaraBead® Au conductive particles have outstanding size uniformity, high conductivity, appropriate elasticity and strong adhesion between the metal layer and the resin core. Designed specifically for vertical connection of fine-pitch electrodes, FaraBead® Au conductive particles are used, for example, in the interconnect between the two glass panels in the fabrication of LCD cells. Characteristics u Monodisperse resin particles as core and metallic gold as shell u Broad size selection: 3.0 µm − 10.0 µm (in 0.1 µm increment) u Uniform in size and shape, coefficient of variation (CV) ≤ 3.5% u Good dispersivity, no overlaps or aggregates u Suitable hardness for high conduction reliability u Low resistance, high stability under heat and humidity Optical and SEM micrographs of FaraBead® Au particles FaraBead® Au Product Diameter Increment CV K at 10% deformation* metal thickness metal content Application µm µm kgf / mm2 nm % GD 7.00–10.00 0.25 ≤3.5% ~450 100–150 25–35 LCD 3.00–6.75 0.25 ≤3.5% ~500 100–150 30–40 GDL 7.00–10.00 0.25 ≤3.5% ~250 100–150 25–35 ACF,ACP 3.00–6.75 0.25 ≤3.5% ~300 100–150 30–40 * The K value at 10% deformation is defined by the following equation: K=(32)∙F∙S-3/2∙R-1/2 wherein F and S represent a load value (kgf) and a compression displacement (mm) at 10% compression deformation of the particle, respectively, and R represents a radius (mm) of the particle. http://www.nanomicro-technology.com
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