Power Distribution Equipment

1. Home
2. Products
3. Electronic & Electrical
4. Power Distribution Equipment

Share us

PCB Design And Fabrication 10 Layer Bga Tg170 Gold Finger Hole Size 0.2mm

CTEL1010200

Send Inquiry

Description

PCB Design And Fabrication 10 Layer? Bga Tg170 Gold Finger Hole Size 0.2mm

- - - -
? | Product Description |
Model Number: | CTEL1010200 |
Number of Layer: | 10Layer |
Material: | FR4 tg170 |
Finish? Thickness: | 2.4mm |
copper: | 1oz |
PCB Size : | 55*109mm |
Line Width/line space | 10/8mil |
Min.Hole size : | 0.2mm |
Surface finish : | Gold finger |
? | Green solder mask |
? | White sillkscreen |
Place of Origin: | China |
Brand Name: | ChiTun |
Certification: | UL,ROHS,ISO |
Standard: | IPC ?standard |
- - - -

?

TECHNOLOGY:

. RoHS/ Lead Free

. HDI Microvias

. Blind Vias

. Buried Vias

. Selective Plating

. Impedance Control

Manufacturing Standard:

. IPC-A-600G Class II

. IPC-A-600G Class III

. PERFAG 2E for Double-Sided Board

. PERFAG 3C for Multilayer Board

?

Capability

Min. Finished Holes Size: 0.008& quot; (0.20mm)

Micro vias diameter: 0.004 TO 0.010 inches (0.10 - 0.25mm)

Minimum line width/spacing: 0.004/0.004 inches (0.10mm/ 0.10mm)

Maximum copper thickness: 5oz (140um)

?

Thin board thickness:

. DS - 0.008 inches (0.20mm)

. 4/L - 0.016 (0.40mm)

. 6/L - 0.020 inches (0.60mm)

?

Maximum board thickness:

. 275.8mil (7.0mm)

?

Surface treatment:

. HASL/lead free HAL/gold plating

. Immersion gold

. Immersion tin

. Immersion silver

. Gold fingers (hard gold)

. OSP

Read More