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Cover And Lids
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Cover And Lids

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Description

Baienwei cover lids are used for high reliability applications in semiconductor, microelectronic packaging, RF/microwave, MEMS, crystal oscillator, medical and optical devices.Hermetic lids for sealing heat sensitive electronics;Hermetic lids for for optical packages;Hermetic lids for RF/microwave packages;Hermetic lids for integrated circuit packages.

Cover And Lids, Electronic Packages,

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Tianjin Baienwei New Material Technology Co,Ltd

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Address: No. 13, Baofu Road, Tianbao Industrial District, Baodi, Tianjin,China.,
Tianjin, Tianjin
China, 301800

Tel: 86-022-29291825
Fax: 86-022-29291821

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