Electronic & Electrical
Description
Product DetailsBrief Description for LF-02 SACX0307 solder pasteSolder paste is prepared by kneading solder powder and solder flux and is used for surface mounting PC boards. BBIEN’S solder paste is a combination of solder powder without oxidation in a uniform particle size and flux with excellent chemical stability.BBIEN& acute;s Sn99Ag0.3Cu0.7 solder paste is a no-clean tacky soldering flux formula that possesses a high activity level,Website:http://www.bbiensolder.com, allowing it to solder nickel surfaces. The robust wetting action of this solder paste ?will allow OSP treated copper, as well as heavily oxidized copper, surfaces to exhibit good soldering properties, even after 2 or 3 thermal cycles. Following reflow, SAC0307 will leave aesthetically pleasing clear residues on the assembly. Sn99Ag0.3Cu0.7 is designed for a high range of temperature and humidity conditions.?Flow Chart for Quality Guarantee:Material Inspection ( a. Our QA Department?? b. National Certification Department Note: Major material ) →Flux character Inspection→ Process products → Solder Paste Inspection → Solder Paste Package Inspection → Finished Products Inspection → Shipment Choice Inspection .Physical Properties(Data given for Sn99Ag0.3Cu0.7, 90% metal, -325+500 mesh)Data representative for most SnAgCu compositionsStandard Applications(For stencil printing)88.0% metal for -325+500 mesh87.5% metals for -400+500 meshViscosity (typical)1500 poise (-325+500 mesh)1550 poise (-400+500 mesh)Malcom viscometer @ 10rpm and 25°CInitial Tackiness (typical)?27 gramsTested to J-STD-005, IPC-TM-650, Method 2.4.44Slump Test?PassTested to J-STD-005, IPC-TM-650, Method 2.4.35Solder Ball TestPreferredTested to J-STD-005, IPC-TM-650, Method 2.4.43Wetting Test: PassTested to J-STD-005, IPC-TM-650, Method 2.4.45Copper Mirror CorrosionLowTested to J-STD-004, IPC-TM-650, Method 2.3.32Corrosion TestLowTested to J-STD-004, IPC-TM-650, Method 2.6.15ApplicationBBIEN SAC0307 high temperature lead free solder paste is ide
High Temperature Solder Paste SACX0307, Lead Free Solder Paste,Read More
SHENZHEN BBIEN TECHNOLOGY CO.,LTD
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Address: 5th/F,Jindu聽Building,BanXuegang Road No.1-4,Bantian Street,Longgang聽Distric, Shenzhen聽City,China,
ShenZhen, Guangdong
China, 518129
Tel: 86-755-36852840
Fax: 86-755-89201839
