Chemical Auxiliary
Description
EDTP(Q75), electroplating brightener for copper
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Molecular formula: C14H32N2O4
Molecular weight: 292.42
CAS NO.:102-60-3
EINECS: 203-041-4
1)Quality Standards: Q/LZ 39-2008
Appearance: Colorless transparent liquid
Assay: min 75.0%?
PH Value: 7.5-8.5
Density: 1.04-1.06
2)Application
Concentration in the bath: 10-30 mg/L
Usage: It is soluble in water, weakly alkaline aqueous solution. Mainly used for chemical copper complexing agent. EDTP(Q75), used as copper electroplating chemicals, copper electroplating intermediates, copper electroplating additives; copper plating chemicals, copper plating intermediates, copper plating additives,copper electroplating brightener, copper plating brightener.
3)Names:
EDTP(Q75);N,N,N,N-Tetrakis(2-hydroxypropyl)ethylenediamine;1,1,1,1-(1,2-ethanediyldinitrilo)tetrakis-2-propano;1,1,1,1-(1,2-ethanediyldinitrilo)tetrakis-2-Propanol;1,1,1,1-(ethylenedinitrilo)tetra-2-propano;1,1,1,1-ethane-1,2-diylbisazanediyl-tetrakis-propan-2-ol;1,1,1,1-ethylenedinitrilotetrapropan-2-ol;1’,1’,1’,1-(1,2-ethanediyldinitrilo)tetrakis-2-propano;adekaquadrol;entprol.
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Wuhan Dike Surface Finishing Chemicals Co., Ltd
electroplating brightening agent,plating brightening agent,nickel electroplating brighteners,acid copper brightener,nickel plating intermediates
Address: Hubei Huake Project Base, No. 1, Lingjiashan South Road, Optical Valley Avenue, Donghu Development Zone,
Wuhan, Hubei
China, 430041
Tel: 0086-27-87053896
Fax: 0086-27-87446231
