Passive Components
Description
PCBA capacity
Item
Specification
1
Type of Assembly
SMT Assembly (Surface-mounting technology)
Thru-hole Assembly (Through-hole soldering Technology)
2
Solder Type
Water soluble solder paste, lead free
3
Component
Component sourcing service
4
Min. IC Pitch
0.30mm
5
Foot Pin
SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
6
Min. Chip Placement
1005
7
Max. PCB Size
600mm*400mm
8
Min. PCB Thickness
0.35mm
9
Max. BGA Size
74mm*74mm
10
Max. Ball Pitch
1mm-3mm
11
Max. Ball Diameter
0.4mm-1mm
12
QFP Lead Pitch
0.38mm-2.54mm
13
Package
Inner package: anti-static bubble Bag
Outer Package: carton box
14
Certificate
PCB Assembly with UL, RoHS approval
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Hebei Chenfei Electronic Tech Co.,Ltd
PCB
Address: Room聽1702聽Wangjiao聽Plaza,Cross聽of聽Xinshi聽North聽Road聽and聽Shitong聽Street,
Shijiazhuang, Hebei
China, 050000
Tel: 86-311-85833960
Fax: 86-311-85833970